IBM Intel Xeon E5506 Spécifications télécharger pdf (Page 9)

Thermal/Mechanical Design Guide 9

Introduction

1 Introduction

This document provides guidelines for the design of thermal and mechanical solutions

for 2-socket server and 2-socket Workstation processors in the Intel® Xeon® 5500

Platform. The processors covered include those listed in the Intel® Xeon® Processor

5500 Series Datasheet, Volume 1 and the follow-on processors. The design guidelines

apply to the follow-on processors in their current stage of development and are not

expected to change as they mature. The components described in this document

include:

• The processor thermal solution (heatsink) and associated retention hardware.

• The LGA1366 socket and the Independent Loading Mechanism (ILM) and back

plate.

Processors in 1-socket Workstation platforms are covered in the Intel® Xeon®

Processor 3500 Series Thermal/Mechanical Design Guide.

The goals of this document are:

• To assist board and system thermal mechanical designers.

• To assist designers and suppliers of processor heatsinks.

Thermal profiles and other processor specifications are provided in the Datasheet.

Figure 1-1. Intel® Xeon® 5500 Platform Socket Stack

Heatsink

Socket and ILM

Back Plate

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IBM Intel Xeon E5506 Spécifications Page 9