IBM Intel Xeon E5506 Spécifications télécharger pdf (Page 13)

Thermal/Mechanical Design Guide 13

LGA1366 Socket

2 LGA1366 Socket

This chapter describes a surface mount, LGA (Land Grid Array) socket intended for

processors in the Intel® Xeon® 5500 Platform. The socket provides I/O, power and

ground contacts. The socket contains 1366 contacts arrayed about a cavity in the

center of the socket with lead-free solder balls for surface mounting on the

motherboard.

The socket has 1366 contacts with 1.016 mm X 1.016 mm pitch (X by Y) in a

43x41 grid array with 21x17 grid depopulation in the center of the array and selective

depopulation elsewhere.

The socket must be compatible with the package (processor) and the Independent

Loading Mechanism (ILM). The design includes a back plate which is integral to having

a uniform load on the socket solder joints. Socket loading specifications are listed in

Chapter 4.

Figure 2-1. LGA1366 Socket with Pick and Place Cover Removed

socket

cavity

package socket

cavity

package

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IBM Intel Xeon E5506 Spécifications Page 13