IBM Intel Xeon E5506 Spécifications télécharger pdf (Page 37)

Thermal/Mechanical Design Guide 37

Thermal Solutions

5.5.2 Dual Thermal Profile

Processors that offer dual thermal profile are specified in the appropriate Datasheet.

Dual thermal profile helps mitigate limitations in volumetrically constrained form

factors and allows trade-offs between heatsink cost and TCC activation risk. For

heatsinks that comply to Profile B, yet do not comply to Profile A (1U heatsink in

Figure 5-5), the processor has an increased probability of TCC activation and an

associated measurable performance loss. Measurable performance loss is defined to be

any degradation in processor performance greater than 1.5%. 1.5% is chosen as the

baseline since run-to-run variation in a performance benchmark is typically between 1

and 2%.

Figure 5-4. Processor Thermal Characterization Parameter Relationships

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IBM Intel Xeon E5506 Spécifications Page 37